The Global Thermal Interface Material Market Size is valued at 3.71 billion in 2023 and is predicted to reach 8.61 billion by the year 2031 at an 11.28% CAGR during the forecast period for 2024-2031.
The demand for thermal interface materials is anticipated to rise during the projected period as a result of expanding usage of electronic consumer goods like smartphones and laptops, automation in developing-nation sectors, and rising middle-class disposable income. It is well known that thermal interfaces offer effective heat management solutions needed to increase the system's overall performance and lifespan. Grease, thermal tapes, elastomeric pads, and solders are just a few of the thermal interface goods that are readily accessible on the market.
Mechanical considerations, electrical insulation, quality, heat resistance, performance, and material compatibility all play a role in the choice of materials. All parts of data centers, including switches, serve boards, supervisor modules, and power supply, use thermal interface material.
Additionally, the rising popularity of electric vehicles helps to boost thermal interface material market revenue. TIM can preserve irritating characteristics and assist in heat dissipation when paired with low viscosity and strong thermal conductivity. In wealthy nations like the U.S., the rising use of smartphones and other smart gadgets has increased the demand for thermal interface materials. It is also anticipated that the rise in the computer sector and increased IT activities will drive demand for fast-speed networks, greater bandwidth, and improved system performance.
Recent Developments:
- In September 2022, Parker Hannifin Corporation introduced THERM A GAP GEL 37, a brand-new, single-component, dispensable substance. The company's product range in the TIMs market will be strengthened by the introduction of this new product.
- In June 2020, Dow introduced the DOWSIL TC-4040 dispensable thermal pad, a new product that is a thermal interface material (TIM) that is simple to dispense, resists slumping, and offers strong thermal conductivity. This property is essential in 5G designs because they generate more heat due to higher power densities.
Competitive Landscape:
Some of the thermal interface material market players are:
- 3M
- Aremco Products Inc.
- Denka Company Ltd.
- Dow
- DuPont
- Electrolube
- Fujipoly - Thermal Interface Materials
- Henkel AG & Co. KGaA
- Honeywell International Inc.
- Indium Corporation
- Linseis GmbH
- Lord Corporation
- Master Bond Inc.
- Momentive
- Parker Hannifin Corp.
- Rbc Industries
- Schlegel Electronic Materials, Inc.
- Semikron International Gmbh
- Timtronics
- Universal Science
- Wakefield Thermal, Inc.
Market Segmentation:
The thermal interface material market is segmented into chemistry, type, and application. Based on chemistry, the market is segmented into silicone, epoxy and polyimide. By type, the market is segmented into greases & adhesives, taps & films, and gap fillers. The market is segmented into computers, telecom, consumer, durables, and medical devices based on the applications.
Based On Chemistry, Silicone Is Accounted As A Major Growth Segment In The Thermal Interface Material Market
Based on chemistry, the thermal interface materials industry is divided into silicone, epoxy, polyimide, and other segments. Due to its adherence to a variety of substrates and strong thermal conductivity, silicon is the largest and is predicted to increase at the fastest rate. Silicone is utilized in a variety of thermal interface materials, including adhesives and greases, potting and encapsulant materials, thermal pads, and gap fillers.
The Medical Devices Witness The Largest Growth At A Rapid Rate
Based on applications, the thermal interface materials market is divided into a computer, telecom, consumer durables, medical devices, industrial equipment, automotive electronics, and other segments. The medical devices is the one that is expanding the quickest. Proper thermal management is required for the electrical equipment utilized in the medical sector. To operate constantly and effectively within their operating temperature range, electronics must be kept cool. The market for thermal interface materials is being driven by the rising usage of radiation therapy in the diagnosis and treatment of diseases, the rising demand for wearable electronics and portable medical devices, and the expanding acceptance of information technology-based smart medical devices.
In The Region, The North America Thermal Interface Material Industry Holds A Significant Revenue Share
The market for thermal interface materials is anticipated to be dominated by North America. There seems to be an overwhelming demand from the telecom business in the North American region as a result of the recent rise in perceptions of smartphones and data. However, it is projected that increased investments in infrastructure development and urbanization that benefit governments in booming North American economies will be beneficial for the growth of the local market.
Besides, the Asia-Pacific is anticipated to grow more quickly throughout the projected period due to rising investment in the research & development process and acceptance of solutions in the area. In 2021, Asia Pacific held a significant share in the global market for thermal interface materials. This is due to an expanding industrial base, automation, and manufacturing activities taking place in developing nations.
Thermal interface material Market Report Scope:
Report Attribute |
Specifications |
Market size value in 2023 |
USD 3.71 Bn |
Revenue forecast in 2031 |
USD 8.61 Bn |
Growth rate CAGR |
CAGR of 11.28% from 2024 to 2031 |
Quantitative units |
Representation of revenue in US$ Million, Volume (Ton), and CAGR from 2023 to 2031 |
Historic Year |
2019 to 2023 |
Forecast Year |
2024-2031 |
Report coverage |
The forecast of revenue, the position of the company, the competitive market statistics, growth prospects, and trends |
Segments covered |
Chemistry, Type, And Application |
Regional scope |
North America; Europe; Asia Pacific; Latin America; Middle East & Africa |
Country scope |
U.S.; Canada; U.K.; Germany; China; India; Japan; Brazil; Mexico; The UK; France; Italy; Spain; China; Japan; India; South Korea; Southeast Asia; South Korea; Southeast Asia |
Competitive Landscape |
Laird Technologies Inc., DuPont, Honeywell International Inc., Henkel Corporation, Zalman, 3M, Indium Corporation, Wakefield Thermal, Inc., Parker Hannifin Corporation, Momentive |
Customization scope |
Free customization report with the procurement of the report, Modifications to the regional and segment scope. Particular Geographic competitive landscape. |
Pricing and available payment methods |
Explore pricing alternatives that are customized to your particular study requirements. |